This book introduces high power semiconductor laser packaging design. The characteristics and challenges of the design and various packaging, processing, and testing techniques are detailed by the authors. New technologies, in particular thermal technologies, current applications, and trends in high power semiconductor laser packaging are described at length and assessed.
Packaging of High Power Semiconductor Lasers - Xingsheng Liu, Wei Zhao, Lingling Xiong & Hui Liu
By Xingsheng Liu, Wei Zhao, Lingling Xiong & Hui Liu
This book introduces high power semiconductor laser packaging design. The characteristics and challenges of the design and various packaging, processing, and testing techniques are detailed by the authors. New technologies, in particular thermal technologies, current applications, and trends in high power semiconductor laser packaging are described at length and assessed.
More by Xingsheng Liu, Wei Zhao, Lingling Xiong & Hui Liu